HTB is Thermal Circuits’ proprietary High Tempurature Binder. This organic and inorganic coating is impregnated into materials such as fiberglass and quartz cloth, fiberglass matt and mica to facilitate compatibility of the etched foil element in applications up tto 1500oF. The HTB’s coatings protect and provide m acroscopic immobilization of the heating element and microscopic thermal expansion and contraction at watt densities many times greater than competitiv e products. The use of quartz in the etched foil heater allows for . direct mount without insulation and is preferred by designers forf high-wattage and high-temperature applications.
Wafer Processing
Although application similarities exist in the etched foil heating technology employed in Chuck Technology Integrated Circuitry, there are enough variables in wattage, temperature, and mounting methods to require designers to pay special attention to combining alternative insulations and films in order to insure the success of the end product. For example, this heater/ heat sink assembly consists of an etched foil element encapsulated in a combination laminate of two thin film insulators: one Kapton? polyimide, the other Teflon?. The heater mounts to an anodized heat sink and a sensor is located in the center pedestal. Multi-heater/ heat sink assemblies incorporate into multi-port boards designed to rapidly load/unload for “burning in” of silicone discs used in the computer industry.