Electronic radiator is the maximum temperature of the semiconductor. Generally, the materials with high thermal conductivity of thermal conduction rate are generally selected. Essence Essence At present, the material (2.12W/cm · ℃) ((cm · ℃) of the radiator in the radiator in the radiator in the radiator in the radiator in the radiator of the whole machine products at home and abroad Thermal conductivity thermal conductivity thermal conduction thermal conductivity thermal conductivity thermal conduction thermal conductivity thermal conductivity thermal conductivity, kts011 temperature controller high height, high height, high height, high height, high heat conduction, heat transfer rate thermal biography thermal conduction, heat transmission rate thermal conductivity, thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity H the thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity Thermal conductivity H the thermal conductivity Thermal conductivity Thermal conduction rate Ferry, the, the, the, the, the, the, the, the, the Ferry, the, the, the, the, the, the of which is the good, the performance is good, and the performance is good, which makes it better than heat dissipation. The device is overwhelmed by an overwhelming PTC resistance heater advantage
The installation of aluminum profile electronic radiator greatly affects the ability of the heat sink
1. Relationship between the relationship between the relationship between the relationship between the relationship between the relationship between the relationship between the relationship between the relationship between the relationship between increased power device and the contact contact contact with the radiator heat sink
2. Requires the pads of the pads between the devices.
3. (3. Installation, the hole group holes of the hole group hole group hole group hole are always placed at the base surface ((L/2) position (location position and two or more spiral board spirals The location of the board (group hole) is averaged on the center line of the base surface L/2N)
4. Fastening device needs to ensure torque. Essence
5. After the power Fan Filter Unit installation, do not have the mechanical processing or processing of the power and the radiator, otherwise, otherwise, increase
6. Single radiator ((suitable for the outside of the device chassis) to make a natural natural wind and cold wind and cold wind
7. Natural time, the parallel windy wind is cold, the wind is cold,