The CY-WXN / P Series PCB laser cutting machine can be used in ultraviolet, green light to PCB according to the requirements, and the plates can be used to face the V-CUT, the stamp hole PCB circuit board is precisely cut into the window, and the cover is Package circuit board scrap, a square panel of ordinary light plates, and the like. The device supports automatic upper and lower cuts, which can realize the whole version of the material on a one-time version, the following, or the single-piece recovery action can also be processed.
PCB soft plate combination board laser cutting machine model characteristics:
1. High performance ultraviolet / green laser, laser focus spot, narrow incision;
2. Differential panel process is cleaned, no dust, avoiding the failure of the circuit caused by the conductive;
3. PCB board directly divided into the mount; no contact, no stress;
4. High-precision two-axis work platform, high precision, fast speed;
5. Optional CCD automatic positioning, automatic calibration;
6. Processing process computer software automatic control, software interface real-time feedback, real-time understanding of processing status.
PCB soft plate combination board laser cutting machine model advantages:
1. The light beam is good,
2. High precision,
3. High efficiency,
4. Fully automatic,
5. Simple operation,
6. Safety environmental protection.
7. You can achieve maximum processing format: (dual station) 600 × 500mm; (single station) 700 × 700mm
Mechanical equipment This CY-WXN / P series PCB soft plate bonding board laser cutting machine is suitable for various types of PCB substrate cuts, such as ceramic substrates, soft bonding plates, FR4, PCB, FPC, fingerprint identification modules, covering film, Composite, copper substrate, aluminum substrate, and the like.
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