OPTION_5:HP

  

  Molex, the world’s leading supplier of complete interconnection products, announced the launch of a specially designed high-performance connector system, which enables PCB developers in video, commercial broadcasting and telecommunications industries to transmit various RF signals through a single component, while considering space constraints. RF DIN 1.0/2.3 modular backplane system has a unique convex rubber shell design, which can reach the expansion capacity of up to 10 ports, thus enhancing the flexibility of right-angle PCB insertion and matching.

  John Hicks, product manager of Molex, said: "When integrating video, data and voice applications, system designers are always looking for ways to improve performance and consolidate space. The RF DIN1.0/2.3 modular backplane system provides them with an ultra-small solution suitable for compact space and an excellent method for RF signal routing. "

  This modular board-to-board system provides a variety of options, including standard four-port, 75 Ohm contact type or customizable 6-port, 8-port and 10-port 50 Ohm contact type. DIN 1.0/2.3 interface can achieve the maximum axial joint tolerance of 1.00 mm, providing users with greater flexibility when inserting right-angle PCB. RF DIN 1.0/2.3 backplane system is the only backplane system in the market that can increase the board-to-board content for DC to 3 GHz frequency applications, so it is suitable for CATV, communication systems and high-density radio applications. These connectors also have a push-pull joint design for quick installation, and a plastic shell that is joined in front of RF contacts to prevent crushing damage.


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