Address quoted in this article: http://www.eepw.com.cn/article/202009/418482.htm.
The nRF52805 SoC adopts a wafer-level chip scale package (WLCSP) with a size of only 2.48 x 2.46mm, which supports the wireless design with limited cost and space, so that the MS46SF11 module can be supplied in a compact size of 15.8 x 12 x 2mm, including PCB trace antenna. This module is designed for applications such as beacons, disposable medical equipment, sensors, pens and demoisers. The module can also be deployed as a network processor, allowing another microcontroller to work with nRF52805 SoC, while the powerful 64 MHz 32-bit Arm?Cortex?-M4 processor built into nRF52805 SoC can monitor low-power Bluetooth connections.
In addition to the Nordic SoC, the MS46SF11 module also integrates an industrial-grade 32.768 kHz crystal oscillator to improve the frequency accuracy and stability. It has an operating temperature range of-40 to 80°C and is suitable for demanding environments. The module has passed the pre-certification of FCC, CE and RoHS, which can reduce the user cost and shorten the time to market.
In addition to the Arm Cortex-M4 processor, nRF52805 SoC also includes 192KB flash memory and 24KB RAM. The multi-protocol (low-power Bluetooth/2.4GHz) radio provides power output up to+4dBm and sensitivity of -97dBm (1 Mbps low-power Bluetooth), and the link budget is 101dBm. The peak power consumption of this radio is only 4.6mA(TX 0dBM, RX 1Mbps), while the current consumption of nRF52805 SoC is as low as 0.3μA in the system off state and only 1.1μA in the system on state with 24KB RAM and RTC running. NRF52805 has a series of analog and digital interfaces, such as SPI, UART and TWI, a dual-channel 12-bit ADC and 10 GPIO.
NRF52805 is currently supported by S112 SoftDevice, and will soon be supported by S113 SoftDevice. S112 and S113 SoftDevice (Bluetooth 5.1 authentication protocol software) are memory-optimized peripheral "stacks" that support high throughput of 2 Mbps and CsA # 2 functions. These stacks support up to four connections at the same time as peripherals with broadcasters. In addition, the number of connections and the bandwidth of each connection are configurable, thus realizing the optimization of memory and performance. Both S112 and S113 support LE secure connection, which improves the security compared with traditional LE pairing. S113 also supports the expansion of LE packet length, thus improving throughput and reducing the overhead of each packet.
Eddie Wang, senior marketing manager of Shenzhen Yunli Wuli Technology Co., Ltd. said: "Yunli Wuli has cooperated with Nordic Semiconductor for many years, and we have used many advanced solutions from Nordic."
"We chose nRF52805 SoC for MS46SF11 module because this SoC device has a high-performance Arm Cortex-M4 processor, compact size and extremely low power consumption, which is very suitable for cost-sensitive double-layer PCB wireless design."