The patch packaging device, but the device but the device and the module still have a lot of many, many of the perforated Industrial Electric Fan Heater perforated modules, and the appropriate electronic radiator electronic radiator is determined by determining , Electronic radiator electronic radiator electronic radiator
Introduction to electronic radiator
Small (or heat slices) are made made of alloy boards, and the surface is made to make it made into a radiator. Different power consumption devices are selected from standard parts standard parts standard Enclosure Fan and Filter parts Standard parts Standard parts Standard parts Standard Parts Standard Parts Standard Parts Standard Parts Standard Piece Standard Performance Standard Performance Standard Performance Standard Material Standard Material Standard Material Standard Material Standard Material Standard Material Standard Material Standard Material Standard Performance Standard Performance Standard Permanent Materials Provide Material -based Material Material Material Materials The purpose of electrolyte oxidation, its purpose is to improve efficiency and insulation performance. Essence In natural, natural, natural, natural, natural, cool, cool down, cool down and cool down and cool 10 15 %. Performance Performance Insulation and Insulation and Insulation and Handling Treatment Treatment Treatment Treatment Treatment Treatment Treatment Treatment. Performance Performance Performance Performance Performance Performance Performance Performance Performance
Different electronic radiator gives a curve curve, and the curve curve curve curve curve
Cooling calculation
Most of the losses that are in the capital have become most of the losses.小功率功率器器件件件件件损耗损耗，无小小小件器器器器器器器器器，无无无无无无无无无无无需需需需需需散热散热散热散热散热散热或The knot temperature, the temperature damage of the device is damaged, the heat dissipation device is the heat dissipation. Use cold water and cold water on some large equipment power devices. On the radiator, the main thermal current direction is transmitted from the tube core to the pass to the pass to the device and device, and the bottom bottom of the bottom bottom bottom is passed to the passage to pass to the passage. San passed to pass to or naturally.
The calories are in some heat resistance. The thermal heat resistance of the device chip chip to the device is the as a thermal resistance heat resistance thermal resistance. The device device device device device device device device device Device The device device surface surface surface surface surface surface surface surface -to -surface surface surface and and with the heave and the same as the radiator radiator is RJA = RJC+RCS+RSA. Essence If the device is the most, it is the loss power power power and the nodular temperature conjunctivation temperature allowed by the known device to know the device is ,,,,,.
RJA≤ (TJ-TA)/PD
Then calculate the large radiator to the ambient temperature heat resistance thermal heat resistance heat resistance
R SA≤({T_{J}-T_{A}}Over{P_{D}})-(R JC+R CS)
Out of room for consideration, considering considering considering considering considerations for the environmental temperature of ° C, it is necessary to consider more comparison, TA = 40 = 40 R = 40 ℃ 60 ℃ R JC. Can be found from the data. Essence Essence The installation is related to the installation and the packaging of the device. Essence If the device and device and device and device and device device are adopted using the use of heat conductive oil fat fat or or or the thermal conductivity thermal pad heat conducting thermal cushion thermal pads. After the device is endless after the device is continuous, the RM CS Cocoa Cocoa Cocoa Cocoa Coco Dada/W. PD is the actual power power. Essence Essence
Calculate instance
PA02 (APEX Company Products) is low for low computing computing computing.
Check the PA02 device device: Static and static current current currently value Typical value Typical value Typical value is typical value of 27mA, the most 40mA; device R JC (from the shell from the from the tube core shell shell)
The device is PD:
Pd = pdq+pdout
PDQ is the power consumption of the device circuit. PDOUT is the power consumption of the output power.
pd = IQ (vs+| -vs |)+v^{2} _ {s}/4RL = 37ma (36V)+18v2/4 4 = 21.6W
Take 37mA in the formula medium and medium static current.
散热器热阻R SA计算：R SA≤({T_{J}-T_{A}}Over{P_{D}})-(R_{ JC}+R_{ CS}})
For the balance, TJ is set at 125 ° C, TA is set at 40 ° C, R JC takes the most valuable (R JC = "2" .6 .6 ℃/w), R CS took 0.2 ℃/w, (PA02 directly heat dissipation and heat dissipation On the radiator, the middle heating oil). Will be substituted
R SA≤{125℃-40℃}Over{21.6W}-(2.6℃/W+0.2℃/W)≤1.135℃/W
HSO4 is the heat resistance when the natural flow is/w, and it can ° C. Essence Essence
Precautions
1. The maximum high effort consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption value consumption. To.
2. The favorable direction of the radiator, and the corresponding position on the chassis or case is dispersed (the hot hole is hot hole
3. If the device is electric, it is extremely endless (insulated with the circuit). Essence Essence Essence Yunmu must be used during installation
4. The device pins are scattered and drill holes in the heat. Prevent and Kongbi
5. In addition, different different thermal resistances, heat resistance, heat resistance, can from time to time, can participate in the cross -sectional area of ??the agency and reform). Essence
6. In the calculation, there are some, as settings, as, as, replace, replacement, replacement, and the size of the model size and size are not exactly the same, the same the same, so the same the same Models, etc.) can be produced later. Essence