-transition tempicure (TG) IS 150-160 ° C, it molds at 145-155 ° C, and it cures in less that 150 ° C (Although Sub-Minute Cure is available), Making it Fast ENONASFor High-VoluMe (100,000-Plus/year) Vehicle Production. It Achieves Post-MOLD CURES of more than 95%. The system is free of solver-organic compounds (vocs).
Highly Non-Traditational Products Wee Required to Meet the Demanding Specs. ""
Reach 150 ° C, The Chemistry is & lsquo; Hot & rsquo; and Cure Advances Quickly. "Dow Submitted 21 Patent Applications and so far,
Less Costly Alloys, Offering AdDitional Weight and Cost Savings.
Needed Higher Flow than Prepreg, so a slightety different grade, vorafuse m6400, was developed.
NO SIGNIFICANT DIMENSIONAL CHANGES WERE OBSERVED).
-Hour Rear Impacts. Assemblies passed both virtual and physical testing issues.
That master has been reduced at least 35% with 2-millimeter wants, and the event further with 1.5-Millimeter Walls.
The Carbon Fiber/Epoxy SMC PASSED All Ford Requirements and Now Can be used on Commercial Platforms, Although Cost Would Be Higher than Conventional Glass Fiber/Polyester Smc.
These multi-material assemblies were subjected to demanding requirements, including torsional and bending loads, lateral stability, corrosion resistance, long-term durability and rear-crash tests. They also had to meet stringent dimensional-stability requirements with respect to margins and flushness.
While the hybrid system easily passed most requirements, there were fit and finish issues owing to coefficient of linear thermal expansion (CLTE) mismatches between composite inner panels and aluminum outer panels, which led to residual-stress buildup in bonded joints and panel distortion after cool down. Subsequent work with Purdue University’s simulation team focused on improving predictions of modulus, strength and cure kinetics for the 1K epoxy adhesive (chosen for its ability to survive e-coat temperatures) in hopes of reverse-engineering an adhesive that would work better. Warpage was reduced an order of magnitude, but slightly missed the target. Several solutions are possible: a 2K/room-temperature-cure or induction-cure adhesive could be tried or a new high-temperature adhesive could be developed. Longer term , replacing aluminum with carbon fiber composite on the outer panel would eliminate the problem, as would producing the liftgate offline and adding it later in the vehicle-build sequence. However, both options add cost.
Project 3.2 is now SMC molding wrapping up but has produced interesting technology, some of which — the B pillar prepreg and SMC SMC molding decklid — is commercial-ready, and some of which points to areas where further work is needed.