Early FPC flexible panels are mainly achieved by mechanical implementation, but with the continuous development of high-density FPC, mechanical drilling techniques have not satisfied with punching small diameter, high precision and high efficiency market demand.
The Beyondlaser model is a CY-UVPH-5565 laser punch gradually replaces mechanical drilling, which has become the mainstream processing technology of FPC plate micropores, and the corresponding laser punching equipment has developed rapidly. Compared to mechanical punching, ultraviolet laser FPC punch has a higher resolution and smaller processing aperture, and since the laser head does not contact the workpiece, there is no tool wear, there is a significant cost advantage. According to the price ratio and other aspects, the general aperture range is preferably a hole in a hole, a mechanical processing; 150 to 100 μm aperture, a CO2 laser punch; 100 μm or less, an ultraviolet UV laser punch cutting.
CY-UVPH-5565UV UV laser puncher equipment principle:
By utilizing high-energy laser sources and precise control of the laser beam, the processing speed can be effectively improved to obtain precise processing results. Mainly applied to HDI boards, flexible plate UV ultraviolet laser drills, first-order blind holes, bleed blind holes, through holes, fast drilling speed, good well quality, reliability, and high stability.
CY-UVPH-5565UV UV laser puncher equipment core application:
(1) Laser diamond blind hole for drilling soft circuit boards: through hole: almost satisfying laser processing of various soft board materials;
(2) Covering the membrane UV laser cutting, carbonization phenomenon is low;
(3) HDI hardboard punch.
(4) UV laser opening cover, blind, and blind-cut depth fluctuations in the soft and hard board<±100um；
At present, the application function of UV ultraviolet laser equipment has been widely recognized by customers, with a certain price / performance ratio. Welcome to the Product Center to learn about the device.
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