At present, the RF filter chip market is mainly monopolized by international giants such as Broadcom, Skyworks, Qorvo and Murata, and the domestic self-sufficiency rate is low.
Recently, Jingxun Juzhen Technology Co., Ltd. (hereinafter referred to as Jingxun) officially released its own B41 full-band FBAR filter and B40 filter in Zhuhai.
According to Jingxun, the unique single crystal doped piezoelectric material and single crystal thin film electrode technology of FBAR filter introduced this time can redefine the performance of FBAR resonator and filter, and innovatively invent a new low-cost wafer-level Bump-on-Via WLP packaging technology. The SC-FBAR filter designed and produced by the above technology can reduce the package size while supporting high power, and has the thinnest WLP package in the industry, large bandwidth, high out-of-band rejection and low insertion loss. B41 and B40 filters do not need additional external matching.
In addition, Jingxun revealed that it will release high-performance 5G n79 filter, n77+n79 diplexer and a low-cost and high-performance B3 diplexer in Q3 2020. In Q4, 2020, the B1+B3 quadrupler will be released.
Founded in 2017 by industry leader Dror Hurvits in Zhuhai, Jingxun is the only domestic manufacturer of high-performance FBAR filter IDM with many American patents. Jingxun has obtained 9 American invention patents, and another 19 American and China patent applications are under examination and approval; Its patent pool covers filter design, resonator structure, packaging method and manufacturing. In the next 18 months, the number of Jingxun patents will double. In the 5G era, Jingxun can provide world-class high-performance SC-FBAR filters, diplexers and multiplexers for mobile phones, modules, intelligent terminals and small base stations.
It is reported that Jingxun’s advanced process center for R&D and production in Tianjin is the only semiconductor factory in the world with the ability to epitaxially dope piezoelectric films and electrode films, and has excellent mass production Trimming ability. Jingxun’s current 6-inch wafer production capacity can reach 1500 wafers/month, and will be expanded to 5000 wafers/month in the second half of 2020.
It is worth noting that under the background of domestic substitution, domestic RF front-end chip manufacturers have also ushered in a good development opportunity. According to Jingxun, continuous innovation and intellectual property accumulation have enabled Jingxun to break through the patent and technology monopoly of American and Japanese companies on BAW/FBAR filters, and also gain investment from leading domestic semiconductor companies, industrial funds and listed companies. (Proofreading/Tu Tu)